3D Chiplet Expert

Location: Leuven (Belgium), Grenoble (France), Nice (France) or remote

About Us: Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking colleagues to join our dynamic team and disrupt the industry together.

About What You Will Do: We are seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

Key Responsibilities:

• • Integration Architecture & Process Definition:
• Develop and define architectures for 2.5D/3D stacking and heterogeneous integration of VIM …